TSMC unveils faster, greener chips for AI
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The news: Taiwan Semiconductor Manufacturing unveiled technology for making faster chips and assembling them in dinner-plate sized packages aimed at artificial intelligence applications.
Production using its A14 fabrication process will begin in 2028, delivering processors that are 15% faster at the same power or use 30% less power at the same speed compared to its N2 chips due this year, it said.
TSMC also said its forthcoming “System on Wafer-X” will be able to weave together at least 16 large computing chips, memory chips, optical interconnections and new power delivery technology, Reuters reported. An intermediary A16 process is planned for late 2026, Bloomberg noted.
It plans to build two factories near its Arizona plants to carry out the work.
The numbers: The company expects semiconductor demand to continue rising, with total industry revenue to “easily” exceed USD1 trillion by the end of the decade.
It is spending about USD40 billion in capital expenditures this year, according to Bloomberg. Intel is set to announce competing technology next week.
